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Discussion: “Stress Distributions in Plane Strain Layered Elastic Solids Subjected to Arbitrary Boundary Loading” (Gupta, P. K., Walowit, J. A., and Finkin, E. F., 1973, ASME J. Lubr. Technol., 95, pp. 427–432)
Publisher: The American Society of Mechanical Engineers (ASME)
Analysis and Design for Zero Impact Wear
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wear life analysis methods are set forth for mechanical components subjected to a large number of repeated compound impacts (normal impact coupled with relative sliding). The wear mechanism in ...
Structural Analysis For Circuit Card Systems Subjected to Bending
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The determination of stress in a typical module/lead/card system is generally a very complex task. In the present paper a new engineering modeling approach is given, high-lighting simple, ...
The Optimal Wearpath Principle
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The concept of the optimal wearpath is helpful in determining the geometrical formation of the wear scar due to repeated contact loading. By definition it is that shape which alleviates the ...
Torsion of Elastically Coupled Plates With Applications to Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The coupling of a square base plate to another reinforcing plate is solved for torsional loads. Nondimensional analysis is carried out using thin plate theory. The distribution of connecting ...
Sliding Failure Model for Magnetic Head-Disk Interface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A mechanical model is presented for the “time to failure” of a sliding magnetic head-disk interface system. The principal physical variables include the sliding speed, surface topography, elastic ...
Thermal Stress Analysis of Pin Grid Array Structures: Module and Card Interactions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: While primary thermal stress analysis of pin grid arrays considers a nonflexible card and module delineating the structure, in this paper we consider the stress relief (resulting in a “secondary” ...
Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Engineering analysis of module-populated printed circuit cards subjected to torsion is pursued by approximate engineering analysis, numerical (finite element), and experimental means. The engineering ...
Contact Stress Analysis for a Round Body Indenting a Linearly Viscoelastic Slab, by Point Matching
Publisher: The American Society of Mechanical Engineers (ASME)
The Elastohydrodynamic Lubrication of a Thin Layer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The elastohydrodynamic lubrication problem of a thin elastic layer pressed between two cylinders which rotate in opposite directions is discussed. The analysis leads to an integro-differential ...